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TM4C129CNCZAD: Inquiry about Underfill implementation

Part Number: TM4C129CNCZAD

Hello Team,


Our customer is considering to use under-fill due to improve the robustness. According to customer’s email, Customer is covering their board with under-fill and customer is putting it in the furnace. (temperature is 120 degree-C / 15min).

First of all, customer would like to know your Expert’s advice / comments on this. This mean. Customer would like to know If there is any problem or not. If there is any specification/User-Guide for under-fill, it is really appreciated.

 And then, Would you ever hear TI’s customer is using under-fill for this device?

I don’t believe TI recommends the use of underfill. However, please let me confirm.

Best regards,