Hello Team,
Our customer is considering to use under-fill due to improve the robustness. According to customer’s email, Customer is covering their board with under-fill and customer is putting it in the furnace. (temperature is 120 degree-C / 15min).
First of all, customer would like to know your Expert’s advice / comments on this. This mean. Customer would like to know If there is any problem or not. If there is any specification/User-Guide for under-fill, it is really appreciated.
And then, Would you ever hear TI’s customer is using under-fill for this device?
I don’t believe TI recommends the use of underfill. However, please let me confirm.
Best regards,
Miyazaki