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TM4C123GH6PGE: PCBA Routing support

Kevin Den Toom
Prodigy 450 points
Part Number: TM4C123GH6PGE

Hi,

currently the QFP chip is used in this application. The problem is this package size is too big.

Experience on routing BGA packages is in house. Although the pitch of 0.5mm is very small. The traces need 25umm copper thickness and can therfor not be routed between the via's. To have this component sitting on a module is too expensive.

Where and how can I find support on how to layout in this situation?

Best Regards

  • 0
    TI__Guru*** 128095 points

    Hello Kevin,

    Kevin Den Toom said:
    currently the QFP chip is used in this application. The problem is this package size is too big.

    It sounds like what they want to do is find a different device with a smaller package like BGA, is that correct? We have very few BGA options for TM4C123x so while I initially wanted to say we need to compare peripherals, I don't think that's the case. Both options match the current device functionality (per your E2E part number anyways). So their choices are:

    https://www.ti.com/product/TM4C123GH6ZRB

    and

    https://www.ti.com/product/TM4C123GH6ZXR

    Kevin Den Toom said:
    Where and how can I find support on how to layout in this situation?

    Note from a layout support perspective, we provide detailed layout comments in our System Design Guidelines: https://www.ti.com/lit/an/spma059/spma059.pdf

    That includes how to handle the BGA package routing, though some of the more specific comments are only for 157-Ball BGA Package (ZRB) which means they may want to use the TM4C123GH6ZRB is they need to follow the document closely for layout purposes.