A customer I am working with has a few questions about the use of the internal temperature sensor and I wanted to check with the experts.
1. Which temperature is being measured here? Junction temperature? Case temperature?
a. What could affect this reading? They read somewhere that gpio configuration could affect this reading and my assumption is that this would be due to higher current consumption and therefore heat in the entire device depending on gpio usage. Is this correct and are there factors other than operating configurations that would affect this measurement?
2. The datasheet mentions in section 13.3.6 that one of the purposes of the sensor is "to notify the system that internal temperature is too high or low reliable operation". Are the threshold temperatures (I am assuming -40 --> 85 C based on device) something the customer needs to monitor themselves?
3. The second described purpose in section 13.3.6 is "to provide temperature measurements for calibration of the Hibernate module RTC trim value." Can you elaborate how the temperature reading would be used to adjust the RTC trim value? I am assuming this reading could be used to adjust the trim value dynamically based on the temperature characteristics of the oscillator used for the RTC but wanted to confirm understanding here.