• State TI Thinks Resolved
  • Locked Locked
  • Replies 6 replies
  • Answers 1 answer
  • Subscribers 29 subscribers
  • Views 263 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

SM320F2812-HT: Pad frame layout

Brandon Dyer1
Intellectual 500 points
Part Number: SM320F2812-HT
Other Parts Discussed in Thread: TEST2

Hello,

I have a question concerning the pad frame layout for the SM320F2812-HT bare die part.  The -HT datasheet shows that there are 201 pads (illustrated in Figure 2-1).  However, locations are given for only 179 pads.  I assume the reason for this is that the no connect pads are not listed.  Do you have any information that includes the no connect pad locations?  For my application, I need to be able to visibly identify each pad, regardless of its functionality.

Thank you,

Brandon

  • 0
    TI__Guru 74730 points

    Brandon,

    The information you are looking for is in Table 2-3 Signal Descriptions a few pages down.  You'll see the Die Pad # in the 3rd column to correlate to the signal name in the first column.  The X/Y co-ordinates are also included in columns 4/5 

    These are all the PADs that need bonding for the device to work correctly.  You can look in the description column for more info on the exact function of each pin, since you are bonding you'll have more flexibility than a customer using a package device in this regard.  

    For instance, there are pad/signals TEST1 and TEST2 that are reserved for TI testing.  These have to be floated, so in your case you could just not bond them vs having an unused pin as the package device does.  If you have questions on any of the other pads/signals, let me know.

    Best,

    Matthew

  • 0 in reply to MatthewPate
    Intellectual 500 points

    Matthew,

    What I am really needing to know in addition to the information in this table is the locations for the no connect pads.  This allows me to create a CAD drawing of all pad locations, which is then used to visually program for wire bonding.  If I don't show the non wire bondable pads in my CAD drawing, they could easily get mistaken for a pad that is suppose to be wire bonded.  Hope that makes sense.    

  • 0 in reply to Brandon Dyer1
    TI__Guru 74730 points

    Brandon,

    Thanks for the detail, that clears up your question.  I should be able to get you that info, just need a day or so.

    I'll reply back no later than tomm on the progress.

    Best,

    Matthew

  • 0 in reply to MatthewPate
    TI__Guru 74730 points

    Brandon,

    Wanted to let you know I'm still interfacing with the chip design team to get this info for you.  Will reply back tomm evening with an update.

    Best,

    Matthew

  • 0 in reply to MatthewPate
    TI__Guru 74730 points

    Brandon,

    Please find the completed pad co-ordinates in the attached XLS. 

    I did find an error in the existing table in the DS.  Pads 12/13 had their X co-ordinate swapped.  It is corrected in the attached, but this would have been an issue as the pins in question are Analog VDD pins(AVSSREFBG/AVDDREFBG) and would have resulting in attaching ground to the power rail, etc. 

    I'm going to file a bug against this to get it corrected. 

    Please let me know if you have further questions.

    Best,

    MatthewSM320F2812-HT_Die_Pad_XY.xlsx

  • 0 in reply to MatthewPate
    Intellectual 500 points

    Matthew,

    This is exactly what I was looking for.  I am glad you found the error in the DS.  That would have been a hard one to debug.

    Thanks,

    Brandon