I have a number of pcbas with "TMS320F2809ZGMS" installed on them that went through a thermal cycle test. The parts should not have experienced more than 120 C or less than -40C. The parts appear to be somewhat functioning but seem to have problems accessing some of their internal flash memory sometimes or possibly only the OTP memory. Some of these units seem to be fixed by replacing the crystal on the pcba, but some do not. Also sometimes a unit might start working for a little while and then quit working.
Does this make that the flash or OTP memory could be degraded such that we could have intermittent operation of the units at times. We should not have been writing to flash throughout the thermal cycle test. I noticed the flash has a lower operating range specified for writing to it for this part (0C to 125C). Could the flash still be degraded if you are operating close to -40C?
Some other pcbas with "TMS320F2809ZGMS" may have been exposed to temperatures down to -50C and had failed with a similar failure mode, but earlier in the test.
Could the flash fail if it is powered up and the ambient goes below -40C without writing to it?
Also your datasheet indicates that the write life of the flash could be lowered by writing to it below 0C. Do you have any data on how many writes are likely at various temperatures below 0C?