May we ask for the thickness of the thermal pad for QFP package of TMS320F28379D-Q1?
Is it the same as the highlighted measurement (in red) below?
Thanks in advance!
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The thermal pad (PowerPAD) is actually recessed slightly into the bottom plane of the package -- it is exposing the bottom surface of the die. So there is no thickness that extends below the package. You can find more information about it in this PowerPAD appnote.
The solder stencil guidelines for the package should provide an acceptable amount of solder paste for assembly.