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TMS320F28027F: observations ESD damage in mass production

Dave Hunson
Expert 1720 points
Part Number: TMS320F28027F

hi everyone !

good day .

we are  using  TMS320F28027F in our products.

in mass production sometimes our production get fail after  2 ~10 month due to ESD damage(it probably got ESD damage before manufacturing ) ,we want to make sure that all of MCU or DSP in our board are fine .

what is the solution for that ?

q1: some thing that I came up with is SEM (Scanning electron microscope) ,is that a good way to test with all of MCUs or DSPs by SEM, before manufacture our products?

Q2:is there any other way to make sure that all of our products are fine and did not have ESD damage ?

thanks for attention

Dave.

  • 0
    TI__Guru* 93725 points

    Dave,

                  This is an extremely difficult question to answer without more details. I presume the ESD damage happens during the production process. If so, you need to look into ESD handling/precautions in your production environment. This is not an area where TI can help you. 

    If the ESD damage happens while testing your board, the solution lies in beefing up the circuit design to make it immune to ESD. The challenge lies in determining precisely how the disturbance impacts the circuit. i.e. in identifying exactly how ESD couples into the circuit. In other words, what is the conduit for it to get into the circuit and cause the damage. Once this is identified, it is relatively easy to come up with the protection solution.  ESD protection diodes may be an option. Unfortunately, often times, the shortcomings are discovered after the board is made and hence make the redesign of the board necessary. 

    Many books have been written on this topic and many papers published. The actual circuit design, the components used, the geometry of the components, the board layout, the board stack-up, the shielding employed , all play a role in the immunity strength of the design. Debugging such problems is an iterative process and warrant hands-on debug. It is extremely difficult to debug issues like this remotely. 

    Q1: SEM will not be of much use here. Analysis with SEM (or a similar microscope) comes after the fact. What you need to do is to determine exactly how the ESD damage takes place. 

    Q2: You need to rely on your post-production testing.

  • 0 in reply to Hareesh Janakiraman
    Expert 1720 points

    thanks dear Janakiraman for helping.

    Dave.