This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMS320F28377D-EP: Commercial and EP Difference

Part Number: TMS320F28377D-EP
Other Parts Discussed in Thread: TMS320F28377D,

Hi Team,

Our customer intends to migrate to the EP part to support the procurement needs. A couple of questions about TMS320F28377D-EP and the commercial TMS320F28377D

- Do they have the same die?
- Do they have the same wire bonding?
- Are there any risk(s) in migrating to the EP from the designs with the commercial device?


Thanks in advance!


Kind Regards,

Jejomar

  • Hi Jejomar,

    Thank you for reaching out. For enhanced products, there are no differences between these two variants in terms of performance. The main technical difference between these two products are the increased temperature ranges available in the EP variant. This snippet from the TMS320F28377D-EP product page showcases that the EP version has more rigorous testing to ensure long-term performance in extreme conditions, increased quality control, and reduced variation between chips because all units are produced in the same fab.

    This video also provides a brief summary of TI's enhanced product line: https://training.ti.com/understanding-tis-enhanced-products-value-and-risk-mitigation

    To answer your questions directly:

    - Both devices have the same die

    - EP version uses gold bond wires whereas commercial version uses copper/gold bond wires

    - There should be no design risks as these parts have the exact same pinouts. Concern only arises when using them in the extreme conditions, in which case the customer must follow the datasheet recommendations to maximize the performance.

    Regards,

    Peter