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TIDM-02008: GAN_Fx and AC_CUR_FAULT use in Firmware

Part Number: TIDM-02008

Hello,

My team is running through high temperature testing of the TIDM-02008 module and is experiencing some IC thermal shutdowns. The ICs noticed to have thermal shutdowns are the LMG3410 and the TLV71333PQDBVRQ1.

How are the GaN Faults provided by the LMG3410 daughter cards and AC_CUR_FAULT from the ACS716KLATR are used in the firmware? If either the LMG3410 or TLV71333 become disabled due to overtemperature, should the SW be expected to take any action?

Thank you in advance,

Nick Cohenour