Other Parts Discussed in Thread: TMDSCNCD28379D, LAUNCHXL-F28379D, C2000WARE
Dear Sir,
As I am designing hardware of TMS320F28377, I want to consult on the Bypass circuit design of VDDx.
Usually in my experience I will using via for bypassing the pin by putting the capacitor directly bottom of microcontroller as picture
This design will ensure that capacitor will be closest to VDDx pin and save a lot of space (already pass though inductance/ferrite bead nearby)
Anyway, as I follow the TI LAUNCHXL board design, I found that they are using many Inductance for each VDDIO, VDDOSC, VDDA separately.
Why ? and If it really ncessary ?
Because it will add a lot of hardware design constanit to PCB board, which may resulting in not able to use all-pins available / instead PCB layer&cost.
I would like to confirm that if I use all VDDIO-VDDOSC-VDDA domain as VDD_MCU(3.3VDC) with passing though 30ohm ferrite bead will be fesiable ?
Would it have any hardware impact of stability design ?
Best regards,
Narudol T.