Other Parts Discussed in Thread: TIDM-1001, UCD7138
Pl see attached a pdf file that shows how we plan to implement the Interleaved PS-LLC using TMS320F28379D as described in TIDM-1001 document
These differences are meant to make the design suitable for our application in very tight packaging constraints with more restrained heat management. So we are striving to achieve higher efficiencies. This also forces us to rethink resistive high current sensing as well.
Will appreciate your expert comments.
thnx
robin