Do we have guidelines for BGA routing?
Specifically customer is looking for are general rules for minimum trace width, spacing, via size, and whether via in pad is a valid option for the part.
Thanks,
Wade
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Do we have guidelines for BGA routing?
Specifically customer is looking for are general rules for minimum trace width, spacing, via size, and whether via in pad is a valid option for the part.
Thanks,
Wade
8078.hwg_16c.zipWade,
Attached please find a preliminary document that addresses the .8mm pitch BGA layout. Regarding via in pad - we recommend against putting vias in pads. Doing so will wick the solder from the pad into the via and reduce the reliability of the solder joint.
REgards,
PEter