TMS320F28377S: PCB Layout Consideration for BGA package

Benjamin Zhou

Part Number: TMS320F28377S

Hi Team,

My customer now used TMS320F28377SZWTQ for Auto application, and has concerns for the PCB layout trace, could you kindly help on this?

1) As the TMS320F28377SZWTQ is BGA package, if the PCB layout is used 1OZ copper thickness, would this caused solder risk? or could you kindly share the comments for the PCB layout?

Best Regards
Benjamin

over 5 years ago

0 Kevin Allen18 over 5 years ago

TI__Mastermind 45606 points

Hi Benjamin,

1oz copper layer thickness is standard for PCBs, there shouldn't be a concern for solder risk (even with small pitch BGA). We use 1oz copper for our EVMs, ControlCards and LaunchPads.

Unless there's a good reason to increase the thickness of their design, i.e. to carry more current, they should probably stick with 1oz copper. Please let me know if any additional concerns.

Best,

Kevin

0 Benjamin Zhou over 5 years ago in reply to Kevin Allen18

TI__Expert 4000 points

Hi Kevin,

Very appreciated, thanks.

Best Regards

Benjamin

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TMS320F28377S: PCB Layout Consideration for BGA package