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[FAQ] Where can I find nFBGA package thermal performance information for C2000 MCUs?

MatthewPate
Guru* 75220 points

With the transition from the MicroStar BGA to nFBGA on select C2000 MCUs what are some resources I can use to understand how this change effects my system?

  • 0
    TI__Guru* 75220 points

    Mechanically there is no difference between the two package types. The new package thermal models will be added to the specific device datasheet but until then, please use the below as a reference to compare the different thermal properties of the two packages:

    For further information on the nFBGA package please see the nFBGA Packaging Application Report. 

    For a list of C2000 OPNs that have migrated from Microstar BGA to nfBGA see [FAQ] Product Discontinuation Notice (PDN) PDN20201117001: Are there any differences between Microstar BGA and nFBGA packages?

    TMS320F281x series

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 16.08 10.6 0
    RΘJB Junction to board NA 15.6 0
    RΘJA Junction to free air 42.57 30.7 0
    PSIJT Junction to package top 0.658 0.31 0
    PSIJB Junction to board NA 15.4 0

    TMS320F280x series

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 12.08 10.7 0
    RΘJB Junction to board 16.46 12.2 0
    RΘJA Junction to free air 30.58 27.5 0
    PSIJT Junction to package top 0.418 0.2 0
    PSIJB Junction to board NA 12 0

    TMS320F2809 series

    Thermal Parameter Description °C/W uSTAR BGA nFBGA Air Flow (lfm)
    RΘJC Junction to case 12.08 10.7 0
    RΘJB Junction to board 16.46 12.2 0
    RΘJA Junction to free air 30.58 27.5 0
    PSIJT Junction to package top 0.418 0.2 0
    PSIJB Junction to board NA 12 0

    TMS320F2833x/23x series

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 8.8 9.4 0
    RΘJB Junction to board 12.5 13.5 0
    RΘJA Junction to free air 32.8 28.5 0
    PSIJT Junction to package top 0.09 0.27 0
    PSIJB Junction to board 12.4 13.3 0

    TMS320C2834x

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 10.3 14.2 0
    RΘJB Junction to board 21.2 22 0
    RΘJA Junction to free air 40.8 36.8 0
    PSIJT Junction to package top 0.4 0.41 0
    PSIJB Junction to board 21 21.8 0

    Best regards,
    Matthew