• State Resolved
  • Locked Locked
  • Replies 1 reply
  • Subscribers 83 subscribers
  • Views 97 views
  • Users 0 members are here
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

[FAQ] Where can I find nFBGA package thermal performance information for C2000 MCUs?

MatthewPate
Mastermind 36985 points

With the transition from the MicroStar BGA to nFBGA on select C2000 MCUs what are some resources I can use to understand how this change effects my system?

  • 0
    TI__Mastermind 36985 points

    Mechanically there is no difference between the two package types. The new package thermal models will be added to the specific device datasheet but until then, please use the below as a reference to compare the different thermal properties of the two packages:

    For further information on the nFBGA package please see the nFBGA Packaging Application Report. 

    For a list of C2000 OPNs that have migrated from Microstar BGA to nfBGA see [FAQ] Product Discontinuation Notice (PDN) PDN20201117001: Are there any differences between Microstar BGA and nFBGA packages?

    TMS320F281x series

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 16.08 10.6 0
    RΘJB Junction to board NA 15.6 0
    RΘJA Junction to free air 42.57 30.7 0
    PSIJT Junction to package top 0.658 0.31 0
    PSIJB Junction to board NA 15.4 0

    TMS320F280x series

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 12.08 10.7 0
    RΘJB Junction to board 16.46 12.2 0
    RΘJA Junction to free air 30.58 27.5 0
    PSIJT Junction to package top 0.418 0.2 0
    PSIJB Junction to board NA 12 0

    TMS320F2809 series

    Thermal Parameter Description °C/W uSTAR BGA nFBGA Air Flow (lfm)
    RΘJC Junction to case 12.08 10.7 0
    RΘJB Junction to board 16.46 12.2 0
    RΘJA Junction to free air 30.58 27.5 0
    PSIJT Junction to package top 0.418 0.2 0
    PSIJB Junction to board NA 12 0

    TMS320F2833x/23x series

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 8.8 9.4 0
    RΘJB Junction to board 12.5 13.5 0
    RΘJA Junction to free air 32.8 28.5 0
    PSIJT Junction to package top 0.09 0.27 0
    PSIJB Junction to board 12.4 13.3 0

    TMS320C2834x

    Thermal Parameter Description °C/W uSTAR BGA °C/W nFBGA Air Flow (lfm)
    RΘJC Junction to case 10.3 14.2 0
    RΘJB Junction to board 21.2 22 0
    RΘJA Junction to free air 40.8 36.8 0
    PSIJT Junction to package top 0.4 0.41 0
    PSIJB Junction to board 21 21.8 0

    Best regards,
    Matthew


All content and materials on this site are provided "as is". TI and its respective suppliers and providers of content make no representations about the suitability of these materials for any purpose and disclaim all warranties and conditions with regard to these materials, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property right. No license, either express or implied, by estoppel or otherwise, is granted by TI. Use of the information on this site may require a license from a third party, or a license from TI.

Content on this site may contain or be subject to specific guidelines or limitations on use. All postings and use of the content on this site are subject to the Terms of Use of the site; third parties using this content agree to abide by any limitations or guidelines and to comply with the Terms of Use of this site. TI, its suppliers and providers of content reserve the right to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and materials, its products, programs and services at any time or to move or discontinue any content, products, programs, or services without notice.

TI Worldwide | Contact Us | my.TI Login | Corporate Citizenship

TI is a global semiconductor design and manufacturing company. Innovate with 100,000+ analog ICs and
embedded processors, along with software, tools and the industry’s largest sales/support staff.

© Copyright 1995- Texas Instruments Incorporated. All rights reserved.
Trademarks | Privacy Policy | Terms of Use