Other Parts Discussed in Thread: MSP430F478
Hi,
Our manufacturer has notified our company that the ZQW package for the MSP430F5659 is in Last Time Buy.
He recommends the new ZCA package.
From https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/924896/msp430f478-difference-between-the-msp430f478izqwr-and-msp430f478izcar, I was able to find this information for the MSP430F478:
"The laminate BGA package, or what we call nFBGA package, offers datasheet equivalent performance to MicroStar BGA. nFBGA provides the same X and Y dimensions as MicroStar, in addition to footprint and pinout to ensure pin-to-pin compatibility. The Z package dimensions (thickness) may be slightly thinner in some cases"
Would it be possible to have a confirmation from TI that this statement also applies to the MSP430F5659 and that no board modification is necessary to migrate from MSP430F5659IZQW to MSP430F5659IZCA?
Thank you,
Xavier