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MSP430F5659: On MSP430F5659IZQW becoming obsolite

Part Number: MSP430F5659
Other Parts Discussed in Thread: MSP430F478

Hi,

Our manufacturer has notified our company that the ZQW package for the MSP430F5659 is in Last Time Buy.

He recommends the new ZCA package. 

From https://e2e.ti.com/support/microcontrollers/msp-low-power-microcontrollers-group/msp430/f/msp-low-power-microcontroller-forum/924896/msp430f478-difference-between-the-msp430f478izqwr-and-msp430f478izcar, I was able to find this information for the MSP430F478:

"The laminate BGA package, or what we call nFBGA package, offers datasheet equivalent performance to MicroStar BGA. nFBGA provides the same X and Y dimensions as MicroStar, in addition to footprint and pinout to ensure pin-to-pin compatibility. The Z package dimensions (thickness) may be slightly thinner in some cases"

Would it be possible to have a confirmation from TI that this statement also applies to the MSP430F5659 and that no board modification is necessary to migrate from MSP430F5659IZQW to MSP430F5659IZCA?

Thank you,

Xavier

  • Hi Xavier,

    This is a package change only, so yes, this applies to the F5659.  The footprint and pin out on this device do not change, so you don't need to change anything.

    If you look at the most recent datasheet for this device, it shows the ZCA package has supplanted the ZQW package.

    Does this help?

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