• State
  • Locked Locked
  • Replies 1 reply
  • Subscribers 78 subscribers
  • Views 304 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

MSP430G2xx Thermal Packaging Characteristics

da
Expert 2780 points
Other Parts Discussed in Thread: MSP430G2513

hello.

Please tell me the following parameters of MSP430G2xx
It was not listed on the data sheet of MSP430G2513.

Thermal Packaging Characteristics

    Junction-to-ambient thermal resistance

    Junction-to-case (top) thermal resistance

    Junction-to-case (bottom) thermal resistance

    Junction-to-board thermal resistance

Regards

  • 0
    Guru 227245 points
    Thermal resistance information is normally only given for (rather simple) high-power devices that may require cooling even during normal operation. The MSP is a low-power device and normally doesn't drive nor draw significant currents. An exception are the port pins. However, there are many of them, so a specific single thermal resistance cannot be given. Instead, maximum currents are specified (per pin and per port).
    In conjunction with the specified maximum free-air temperature, this should sufficient.
    Unless you plan to operate the device with all of its pins shorted in a 85°C environment and want to know how large the cooler needs to be. :)

**Attention** This is a public forum