Hello Apps,
According to the datasheet and QFN design guideline(http://www.ti.com/lit/an/sloa122/sloa122.pdf), it’s recommended to use 9 thermal pads design for MSP430FR5859IRHAR.
I suggested stencil design of 9 thermal pads for MSP430FR5859IRHAR as described in datasheet.
However is there any concerns if customer make stencil design for thermal pad shown below just applying only one cross-hatching?
One of my customers wants to use the design below.
Recommendations from datasheet:
Thanks,
Howard Kim