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MSP430FR5859: VQFN Thermal Pad Stencil Design?

Part Number: MSP430FR5859

Hello Apps,

According to the datasheet and QFN design guideline(http://www.ti.com/lit/an/sloa122/sloa122.pdf), it’s recommended to use 9 thermal pads design for MSP430FR5859IRHAR.

I suggested stencil design of 9 thermal pads for MSP430FR5859IRHAR as described in datasheet.
However is there any concerns if customer make stencil design for thermal pad shown below just applying only one cross-hatching?
 
One of my customers wants to use the design below.

 
Recommendations from datasheet:

Thanks,

Howard Kim

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