Team,
we will use MSP430 in BGA49 package YYF (R-XBGA-N49). I wonder what is recommended landing pattern for it.
I have found document www.ti.com/.../spraav1b.pdf, which describes recommended PCB Design
Guidelines for 0.4mm Package-On-Package for OMAP350 processors. Is it valid for smaller BGA49 of MSP430GxxxYYF, too?
Namely what about solder-mask-defined pads vs. non-solder-mask-defined pads design. Please advise.
Thanks for your help.
