MSP430F1232: TJ - junction temperature max

Hi JD,

I should have mentioned the package.  This is the PW package (28 pin TSSOP).

Will you be able to generate the Theta JA/B/C and provide the max TJ?

Thanks,
Darren

Generally, the max TJ is package limited to 150 C due to the epoxy.

Hey Darren,

I believe Keith is referring to storage temp and is correct that the max is listed in the datasheet as 150C for unprogrammed devices.   

For all practical purposes, Max operating TA = Max operating TJ.  We even spec if this way on many of the MSP430F5xx devices.  The reason for this is that at max power the MSP430 consumes milliWatts and the self-heating of the MSP430 is basically not enough to really matter. 

More post here discussing this topic:

https://e2e.ti.com/support/microcontrollers/msp430/f/166/t/576730/

https://e2e.ti.com/support/microcontrollers/msp430/f/166/t/593263

https://e2e.ti.com/support/microcontrollers/msp430/f/166/t/711979

I will submit a request for the Theta JA/B/C for this package and will update this thread when that info comes back.  

Thanks,

JD

No, I am referring to absolute max Tj. It is 150 C for epoxy devices. Whether you can get there with an MSP is another question. When I was working with 10 W plastic packaged power devices, it was easy. 8^)

For silicon, Tj can be limited by 2 things, the package or MTTF. In an air cavity package, you can get the TJ to whatever you want, but higher temperatures cause the metal to fail more quickly (cf Blacks Equation). So typically the part is designed to last 1 million hours at a Tj of 200 C.