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MSP430F478: Difference between the MSP430F478IZQWR and MSP430F478IZCAR

Part Number: MSP430F478


Good day. 

Our customer is currently using the MSP430F478IZQWR however this device is in LTB status and they want to use the MSP430F478IZCAR as an alternate for this. They would like to know if what is the difference between these two orderable part numbers. It seems that they have the same pinouts, package dimension and electrical characteristics. Is there any difference between these 2 parts? Maybe the reflow temperature profile has been change or is it just a change in naming?

I would appreciate your help on this. Thank you. 



  • Hi Cedrick,

    Thanks for posting your question to E2E.

    The majority of TI parts that use MicroStar BGA package will be redesigned using a laminate BGA package that we call nFBGA. This package offers datasheet-equivalent electrical performance. It is also board layout/footprint equivalent to MicroStar, and is a proven package sourced at multiple manufacturing sites. Customers will also have the opportunity to submit of Lifetime Buy (LTB) order for parts, which includes a six month order entry, 12 month order fulfillment with exceptions where we have other contractual terms. There are a handful of parts that will be set to end of life (EOL) without the option of LTB.

    The laminate BGA package, or what we call nFBGA package, offers datasheet equivalent performance to MicroStar BGA. nFBGA provides the same X and Y dimensions as MicroStar, in addition to footprint and pinout to ensure pin-to-pin compatibility. The Z package dimensions (thickness) may be slightly thinner in some cases. For more details, check out this nFBGA application note.