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MSP430FR5962: MSP430FR5962 performance in humid environment

Part Number: MSP430FR5962

Hi MSP430 expert,

The customer is using MSP430FR5962 in humid environment.  Does this device have a limitation for the ambient humidity? I post a similar in the below link. Hope I can get a feedback here. :)

  • PCBs in general have limitations in high humidity. I don't think TI makes any claims for hermeticity of its Industrial-grade IC packages. (I think the Space-rated ones are hermetic.)

    As Keith pointed out over in the other thread, conformal coating is "cheap insurance" against humidity. There are also more aggressive forms of potting (also more difficult to work with).

    Are you trying to diagnose a particular case, or looking for general design recommendations?

  • Yes, once you get condensation, even if it is not "drops", you can have leakage across traces in the board. This can be a big problem with low power MSP designs that use relatively large resistors.

  • For IC device in plastic package (non-hermetic package) not only for typical MSP430 device, there were certain considerations when used in humid environment: device popcorn (SMTA, MSL), IO leakage (condensation), metal corrosion (ionic affection), etc. So customer should assess and perform certain humidity test (salting test etc) to valid the system than device. If humidity sensitive, recommend customer to assess at system level.    

    Moisture related apps notes (link): reference for SMTA than application environment.