Other Parts Discussed in Thread: TEST
This document details the standard process for nFBGA packages:
Specifically p4 Figure3 - this page visualizes the manufacturing process.
What I need to know, is if the ATE test is conducted before the balls are attached, or after, for the MSP430F5528IZXHR.
(Also, I'd like to know this for the MSP430F5528IYFFR too)
Theoretically, if the customer were to send devices back for re-test, can they be put on the ATE equipment and tested again? Or since they are balled, the balls would need to be removed first?
If this info is not classified, please share. If it is, please contact me offline.