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MSP430F5528: Question about nFBGA Package

Part Number: MSP430F5528

This document details the standard process for nFBGA packages: 
https://www.ti.com/lit/an/spraa99b/spraa99b.pdf

Specifically p4 Figure3 - this page visualizes the manufacturing process.

What I need to know, is if the ATE test is conducted before the balls are attached, or after, for the MSP430F5528IZXHR.
(Also, I'd like to know this for the MSP430F5528IYFFR too)

Theoretically, if the customer were to send devices back for re-test, can they be put on the ATE equipment and tested again? Or since they are balled, the balls would need to be removed first?

If this info is not classified, please share. If it is, please contact me offline.

Regards,

Darren

  • Hi Darren,

    I'm checking with our colleagues and will get back to you.

    BR,

    Leo

  • Hi Darren,

    Please find the response from my colleague below:

    For normal BGAs we do the final test with the balls attached to cover the full bonding and assembly process.

    For die size BGA packages we do everything one wafer level but the last wafer test happens with balls means also here the solder connections will be checked.

    But the sawing process is not covered.

    For both ATE retest is possible if we get the de-soldered parts. In this case we would submit them for re-balling before doing bench or ATE retest. Risk for damage on DIE SIZE BGA is higher.

    BR,
    Leo