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MSP430F417-DIE: Die bond of MSP430 die with Immersion Gold

Intellectual 1435 points

Replies: 3

Views: 462

Part Number: MSP430F417-DIE

We are using TI MSP430F417CY on our product.  The current pcb supplier uses gold flash and so far we have no issues. 

 

However, our new pcb supplier only offers Immersion Gold.  Do you think the die bond of this micro would work okay with Immersion Gold? Any suggestions please?

  • Robert,
    I will see if I can locate a process engineer that can provide some insight.
    Regards,
    Wade
  • In reply to Wade Vonbergen:

    Wade, thanks. I expect this would be more of a packaging engineer vs a process engineer.
  • In reply to Robert Eschbach:

    I am assuming this backend process.
    Robert, I will email you with our QA contact. He will work directly with customer to see if we can help.
    Can you Click this answered my question to close this out?

    Thanks,
    Wade

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