MSP430F417-DIE: Die bond of MSP430 die with Immersion Gold

Robert Eschbach

Part Number: MSP430F417-DIE

We are using TI MSP430F417CY on our product. The current pcb supplier uses gold flash and so far we have no issues.

However, our new pcb supplier only offers Immersion Gold. Do you think the die bond of this micro would work okay with Immersion Gold? Any suggestions please?

over 6 years ago

0 Wade Vonbergen over 6 years ago

TI__Guru 62930 points

Robert,
I will see if I can locate a process engineer that can provide some insight.
Regards,
Wade

0 Robert Eschbach over 6 years ago in reply to Wade Vonbergen

TI__Expert 6665 points

Wade, thanks. I expect this would be more of a packaging engineer vs a process engineer.

0 Wade Vonbergen over 6 years ago in reply to Robert Eschbach

TI__Guru 62930 points

I am assuming this backend process.
Robert, I will email you with our QA contact. He will work directly with customer to see if we can help.
Can you Click this answered my question to close this out?

Thanks,
Wade

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MSP430F417-DIE: Die bond of MSP430 die with Immersion Gold