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MSP430F1491: Can I know what is the Tin plating thickness of the QFN lands for part no: MSP430F1491IRTDT

Part Number: MSP430F1491

hi,

Can I check what is the tin plating thickness recommended for MSP430F1491IRTDT?

i saw this link: http://www.ti.com/support-quality/environmental-info/lead-finish-tin-plating.html but i still dont get it.

Best Regards,

kpk

  • Hello Poh,

    What you have pointed to addresses how TI specs the pins/leads coming out of our packaging.

    If you are looking for specifications on the best way to solder down the chip, then please see the package specific mechanical datasheet is what you want to look at. You can find these specifications at the end of the device datasheet in section "8 Mechanical, Packaging, and Orderable Information". you can also find this information within the Order Now tab of the device product page (MSP430F1491 ). Just click on the specific package that is hyperlinked in the middle of the table.

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