Hi,
There are two ways to connect the GND pad to the GND plane:
- direct connection
- relief connection
I understand, that the „relief connection” has to be used for thermal isolation of the pad and the copper plate.
When using SMT soldering, the PCB board is heated almost evenly, so thermal relief isn't generally needed here.
Therefore, I wonder, if it is a good simplification to use a direct connection for SMT soldering and relief connection for THT soldering?
Would you give me recommendations on this subject or would you direct me to any application note in which this subject was discussed?
/Adam