This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

  • Resolved

MSP430F5309: Next generation of product

Prodigy 90 points

Replies: 1

Views: 28

Part Number: MSP430F5309

Hello! The following messages appeared on the msp430f5309 and MSP430F5508 product web-pages:"We are currently planning the next generation of this product. The new part will leverage a laminate BGA package that we call nFBGA. This package offers datasheet-equivalent electrical performance. It is also board layout/footprint equivalent to MicroStar.". Could you tell me what this means? This means that the chip will be produced in additional new case? Or does this mean that the chip will only be available in the new case and will not be further produced, for example, in the LQFP-48 case?

  • Hi Alexei,

    the change is only for the BGA package. We have to change to different package. The other packages are not changed and will be delivered as before.

    Best regards,

    Peter Weber 

    --------------------------------------------------------------------------------------------------------------------------------------

    Please verify the answer by clicking the green  "RESOLVED MY ISSUE " button in case the reply solved your question.

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.