Other Parts Discussed in Thread: MSP430F5508
Hello! The following messages appeared on the msp430f5309 and MSP430F5508 product web-pages:"We are currently planning the next generation of this product. The new part will leverage a laminate BGA package that we call nFBGA. This package offers datasheet-equivalent electrical performance. It is also board layout/footprint equivalent to MicroStar.". Could you tell me what this means? This means that the chip will be produced in additional new case? Or does this mean that the chip will only be available in the new case and will not be further produced, for example, in the LQFP-48 case?
