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Part Number: MSP430F2619S-HT
My Customer is attempting to communicate with the MSP430F2619SPM device during testing at cold temperatures (around -40C), and are occasionally seeing a loss of the capability to communicate with this component during testing at these temperatures.
I see that the part is rated for -55C, so I was wondering if there is any precedent for this failure. Have you seen anything similar during your testing? Is every MSP430F2619SPM tested through establishing communication at these extreme temperatures?
Thanks for the help.
Can you clarify which communication interface is being used and how the device is being clocked? Is the communication conducted directly with the device or is there another chip involved?
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In reply to Leonardo Estevez:
Thank you for your response. I got this details from our customer.
Which communication interface is being used: We communicate via an I2C Bus.
How the device is being clocked: We use the internal system clock configured to run at 1 Mhz, and we also have a 32KHz crystal to clock internal timer peripherals in the uC during awake and sleep modes.
Is the communication conducted directly with the device or is there another chip involved: We are communicating directly with the MSP430F2619SPM via I2C.
Looking forward to your inputs.
In reply to Renan Santos Adriano:
Can you provide some scope captures showing what happens over the I2C lines when the communication fails? Some crystals aren't rated to operate at the colder temperatures - so you might also check to ensure that the chip has a valid clock signal when the communication failure occurs.
I'm Andrew Henricksen with Northrop Grumman.
I can't provide scope pictures during that phase of testing. I have checked the specs on our crystal oscillator and it is rated for lower temperatures than we test at.
I'm more interested in information on the extent of functional testing performed on these chips after manufacturing. Are the MSP430F2619SPM chips tested through establishing communication at extreme temperatures?
In reply to Andrew Henricksen:
We guarantee our parts to operate over their specified operating temperatures. I'm checking with our folks internally to determine exactly how functional/temperature testing is conducted. Do you see this issue across multiple parts/platforms - or was this found to occur on one platform/part?
We're currently only seeing this issue on one of our types of cards, but we've seen it multiple times, and it's intermittent at that.
We're investigating multiple potential causes of the failure, and are trying to rule out the possibility that it may be an issue with the part itself. We want to know if the part is functionally tested via I2C communication at extreme cold temperatures, and if you have seen any recent failures in this testing.
I have confirmed with our fab that we probe test these devices at -40C.
Thank you for the information, I'll let you know if I have any more questions!
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