I was recommended to come here from the support team and post on this X-ray difference.
Both were from TI but showing totally different x-ray images.
The only difference is different batch?
Is there any PCN to explain this difference?
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JY,
I looked into this and found that there are some PCNs related to assembly materials, which would explain the different lead frames that you're seeing in the X-ray images. That being said, when I look up the top marking code for the device you shared, I'm not able to find the lot. I'm working internally on this to find out where that device was assembled and will get back to you.
Regards,
Eric Hackett
JY,
The difference between these two devices is the assembly site, as I suspected. One device was assembled in Taiwan and the other in Malaysia. Since this device was released in 2005, it has gone through difference A/T sites and BOM changes over the years. In our PCN database we have several referencing this.
Please let me know if you have any other questions.
Regards,
Eric Hackett