Hi,
currently the QFP chip is used in this application. The problem is this package size is too big.
Experience on routing BGA packages is in house. Although the pitch of 0.5mm is very small. The traces need 25umm copper thickness and can therfor not be routed between the via's. To have this component sitting on a module is too expensive.
Where and how can I find support on how to layout in this situation?
Best Regards