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DRV3255-Q1: TPA3255Q1 Amplifier IC and Heat Sink Assembly Issues

Part Number: DRV3255-Q1
Other Parts Discussed in Thread: TPA3255

Hi team,

The TPA3255Q1IC height is 1.0 to 1.2 mm on the spec sheet, and the height of the heat sink lock amplifier IC used for the demo board is 1.0 mm.

The customer would like to confirm that if it's proper for the heat sink lock amplifier IC height specification is set to 1.0~1.05 mm. Will it have any impact on the amplifier IC?

Could you help resolve this case? Thanks.

Best Regards,