Other Parts Discussed in Thread: DRV8305
Hi all
My customer is using the DRV8305-Q1 and they are seeing potential issues due to soldering cracks.
They want to run a thermal simulation for this PCB and therefore ask for the CTE (Coefficient of Thermal Expansion) for this device for:
mould / leadframe / die
And if we have soldering recommendations that would also be appreciated.
Best regards
Ueli