Hello,
Is there a way to back calculate the die junction temperature from taking a top-side package measurement?
We are seeing a peak temp of 108oC during operation.
Here is the thermal data from the datasheet:
Thank you, Keith
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Hello,
Is there a way to back calculate the die junction temperature from taking a top-side package measurement?
We are seeing a peak temp of 108oC during operation.
Here is the thermal data from the datasheet:
Thank you, Keith
Hello Keith,
I will consult with my team and aim to provide feedback before the end of the week.
Best Regards,
Akshay
Hello Keith,
Thank you for your patience.
You can use the following information to back calculate the junction temperature.
TJ = junction temperature
TC = Maximum Case Temperature
For more information I would recommend consulting the following app note.
Semiconductor and IC Package Thermal Metrics
Hope this offers some clarification.
Best Regards,
Akshay