Hello,
I am performing a thermal cycle fatigue assessment that accounts for this component. I need CTE values for the electronic package. I could not find info for this on the datasheet. Can this info be provided?
Thanks!
Will
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Hello,
I am performing a thermal cycle fatigue assessment that accounts for this component. I need CTE values for the electronic package. I could not find info for this on the datasheet. Can this info be provided?
Thanks!
Will
Hey Will,
Do you know if your company has an NDA with us? This would certainly fall under some selective information.
You can find the Packaging data about the mold compounds, lead frame alloys, die attach, etc here: https://www.ti.com/quality-reliability-packaging-download/report?opn=DRV8412DDW and then put together a fairly accurate model with that.
Also see Semiconductor and IC Package Thermal Metrics and PowerPAD Thermally Enhanced Package
Best,
Jacob