MCF8315C: DRV10987

Taeseok Oh

Prodigy 10 points

Part Number: MCF8315C
Other Parts Discussed in Thread: DRV10987

Tool/software:

Hello

I have a question about MCF8315C TSSOP product.

This product's package type is same as the DRV10987 and has same package size.

But their thermal resistances are very different.

Rather MCF8315C TSSOP's thermal resistances are similar with MCF8315C QFN type.

So I want to know why MCF8315C and DRV10987 have different thermal resistnaces.

Thank you.

9 months ago

0 Joshua Horlander Cruz 9 months ago

TI__Mastermind 19580 points

Hi,

I will look into this. I will aim to provide you an update by 7/24.

Regards,

Joshua

0 Joshua Horlander Cruz 9 months ago in reply to Joshua Horlander Cruz

TI__Mastermind 19580 points

Hello Taeseok,

The thermal resistance (Rj-a) will be affected by the package, although other factors like die size, layout of the die, die attach material, etc. will also have an effect on the Rj-a.

The differences in the die layout, die attach material, etc. between the DRV10987 and MCF8315C lead to the larger difference in Rj-a between the devices.

Regards,

Joshua

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MCF8315C: DRV10987