DRV8303 is used in a motor drive application with 8-12A, at 35V
Design and layout is close to the TI ref design. Ground pins and the power pad are connected to digital ground, while the power stage has its own ground.
The issue is that during EMC tests significant spikes were seen on the ground. Direct connection of power ground and digital ground didn't change the EMC behaviour. Please provide recommendations about grounding and EMC layout for the DRV8303.
