DRV8873S-Q1EVM: Please describe the Legends/symbols in the Application note for thermal dissipation.

Ashish NAWANI

Intellectual 255 points

Part Number: DRV8873S-Q1EVM

Please clarify the legends.

over 5 years ago

0 Rick Duncan over 5 years ago

TI__Guru** 114905 points

Hi Ashish,

Theta_cu is the lateral thermal resistance of the copper plane.

Lamba_cu is the thermal conductivity of copper (4 W / cm degree C).

Below is similar information with more explanation.

0 Ashish NAWANI over 5 years ago in reply to Rick Duncan

Intellectual 255 points

Thanks alot.

0 Ashish NAWANI over 5 years ago in reply to Rick Duncan

Intellectual 255 points

Thanks alot Rick. I am designing the thermal PAD with the dissipation so that, I can reduce the R-theta-ja from 27.8C/W to 25C/W can you suggest the optimum copper area to be used.

0 Rick Duncan over 5 years ago in reply to Ashish NAWANI

TI__Guru** 114905 points

Hi Ashish,

The thermal pad is only part of the puzzle. There is copper weight (we use 2oz copper on the top and bottom layer), size of ground plane, and how the ground plane is continued out from under the device.

Please refer to www.ti.com/.../snva183b.pdf for more information.

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DRV8873S-Q1EVM: Please describe the Legends/symbols in the Application note for thermal dissipation.