DRV8899-Q1: PCB with 8 layer / 0.5-OZ

Mike Yu

Intellectual 1830 points

Part Number: DRV8899-Q1

Hi Team,

The definition of the PCB layer type only have 2 layer and 4 layer with copper thickness 1-OZ and 2-OZ.

The customer are going to use 8 layer with 0.5-OZ, please reference their layer spec as below.

Is there any stackup limitation on our device? or is there any concern to use 8 layer with 0.5-OZ? Thank you.

Best regards,

Mike

over 3 years ago

0 Ryan Kehr over 3 years ago

TI__Guru 54675 points

Mike,

The examples in the datasheet are just for reference. There is no limitation on board stackup. Just make sure that the thermal vias are internally connected to the GND planes to ensure heat is dissipated into the internal planes. If using the TSSOP package, additional copper pours can we placed on the top layer to aid in heat dissipation.

0 Mike Yu over 3 years ago in reply to Ryan Kehr

TI__Intellectual 1830 points

Hi Ryan,

"The additional copper pours can we placed on the top layer to aid in heat dissipation" is that means that the blank area on the top layer should cover with GND shape and connected to the Thermal pad? Thank you.

Best regards,

Mike

0 Ryan Kehr over 3 years ago in reply to Mike Yu

TI__Guru 54675 points

Mike,

Yes, your understanding is exactly correct.

0 Mike Yu over 3 years ago in reply to Ryan Kehr

TI__Intellectual 1830 points

Hi Ryan,

Get it, thanks for your reply.

Best regards,

Mike

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DRV8899-Q1: PCB with 8 layer / 0.5-OZ