Dear team,
My customer use our TLV733-Q1 in their design. Before they use WSON package which has smaller thermal resistor. This package is out of stock, so they plan to change to SOT-23 package. Now we have a concern,
Ambient temperature is 95°C, RθJA=198.3°C/W, VIN-max=1.89V, VOUT_min=1.148V, IOUT_max=240mA
so the junction temperature = 95+198.3*(1.89-1.148)*0.24=130.3°C which is close to 150°C.
I am not sure whether this package is ok. The customer has no time to test this, so they want to know how big the risk is. Can we make the positive conclusion based on the computation? Or we have other more accurate methods?
Thanks & Regards,
Sherry