CSD75207W15: Component Body Surface Crack Inquiry

Kai Yuan Tan

Part Number: CSD75207W15

Component body surface crack.

Please advise the inquiry below and refer above for the photo.

1. Does the crack surface will have any impact to the functionality?
2. Any acceptance criteria for the crack?
3. What is the material for the cracking surface?

over 3 years ago

0 John Wallace1 over 3 years ago

TI__Mastermind 35530 points

Hello Kai Yuan Tan,

Thanks for your interest in TI FETs. The CSD75207W15 is a wafer level package device. Essentially, it is a silicon die with BGA interconnect and there is no plastic overmolding of the die. Excessive cracking or chipping of the device can cause higher than expected leakage current and/or failure of the device. Attached you will find TI's chip-out limits for this type of FET. There are also links below with more information and handling guidelines for these devices.

Best Regards,

John Wallace

TI FET Applications

0216.Chip-out limits for WLP FETs.pdf

https://www.ti.com/lit/sszqnf6

https://www.ti.com/lit/snva009

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CSD75207W15: Component Body Surface Crack Inquiry