UCC21540: Apply for TI testing

Lynn Lin

Part Number: UCC21540

Solderability test of UCC21540DW was failed,becaus the new solder layer covered less than 95% area of testing pins.

Reference:
https://www.ti.com/lit/ds/symlink/ucc21540.pdf?HQS=ti-null-null-sf-df-pf-sep-wwe&ts=1620806098841&ref_url=https%253A%252F%252Fwww.datasheet5.com%252Fpart%2
52FUCC21540DW%252FTexas%2BInstruments

over 3 years ago

0 Francisco Lauzurique over 3 years ago

TI__Expert 3575 points

Hi Lynn Lin,

Thank you very much for reaching out.

I was wondering if you could provide us more information on how we can assist in this issue.

Do you need further information in in soldering procedures?

Do you need information for soldering profiles?

Let me know what kind of information do you need here and I will be happy to help.

Sincerely,

Francisco Lauzurique

0 Lynn Lin over 3 years ago in reply to Francisco Lauzurique

Prodigy 30 points

Do you need further information in in soldering procedures?

Do you need information for soldering profiles? _Both don't need.
We have already testing in the professional third-party laboratory.And it cannot reach the standard.
So we want TI to test it again,and offer the report.

Thank you.

0 Francisco Lauzurique over 3 years ago in reply to Lynn Lin

TI__Expert 3575 points

Hi Lynn Lin,

Can you share information about the solder being used during the procedure.

Best,

Francisco Lauzurique

0 Francisco Lauzurique over 3 years ago in reply to Francisco Lauzurique

TI__Expert 3575 points

Hi Lymm Lin,

I was able to obtain more information about this issue you are experiencing. The following link has more references for soldering the devices.

AN-2029 Handling and Process Recommendations (Rev. H)

I am working in checking if there is passed history of soldering issues with this devices and I will have more information for you as soon as possible.

Best

Francisco Lauzurique

0 Lynn Lin over 3 years ago in reply to Francisco Lauzurique

Prodigy 30 points

PD-150

0 Francisco Lauzurique over 3 years ago in reply to Lynn Lin

TI__Expert 3575 points

Hi Lynn Lin,

Can you provide more information in what do you mean by PD-150?

We are working on getting you more information about the history on this device.

Was the previous information helpful?

Best

Francisco Lauzurique

0 Francisco Lauzurique over 3 years ago in reply to Francisco Lauzurique

TI__Expert 3575 points

Hi Lynn Lin,

I was able to receive more feedback from our internal teams that specializes on these issues.

It was concluded that based on the image provided there is not evidence of poor wetting or <95% coverage. In addition, post dipping test solder on lead will not always have a smooth appearance.

Can you share more information about the customer company name?

Feel free to reach me out through emails if you would like a more confidential environment.

Let us know if this answer your questions

Best

Francisco Lauzurique

+1 Lynn Lin over 3 years ago in reply to Francisco Lauzurique

Prodigy 30 points

this PIC shows the coverage after dipping

and the solder is 95.59%-Ag3.9

0 Francisco Lauzurique over 3 years ago in reply to Lynn Lin

TI__Expert 3575 points

Hi Lynn Lin,

Thank you very much for your reply. If you would like we can can complete this thread with a call meeting and be able to answer all the questions instantaneously for you. I believe that with a 30 minutes meeting we can help you with this issue.

Let me know if you would like to set up a meeting to help you with this issue.

0 Lynn Lin over 3 years ago in reply to Francisco Lauzurique

Prodigy 30 points

Hi Francisco,

It's nice to have a meeting.
Because time difference,you can contact me by email to confirm the meeting time.

Thank you

0 Francisco Lauzurique over 3 years ago in reply to Lynn Lin

TI__Expert 3575 points

Hi Lynn Lin,

I have received you email. Thank you very much

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UCC21540: Apply for TI testing