TPS7H2201-SP: Questions on CERAMIC DUAL FLATPACK Package

Kurumi Hasegawa

Part Number: TPS7H2201-SP
Other Parts Discussed in Thread: TPS7H2201EVM-CVAL

Hi team,

I’ve got quick questions on CERAMIC DUAL FLATPACK packages, and I’d like to confirm I understand it correct.

1. In the below figure, the lead looks floating ~0.9mm above. It is because of the thickness of the thermal pad I guess. How should I implement it? Is the lead supposed to be bend down slightly to contact with the board?

2. On the picture of the EVM (TPS7H2201EVM-CVAL), the leads are shorten. Is there any need for cutting the lead? Or, is it totally up to the system?

Best regards,

Kurumi

over 2 years ago

+1 Sarah Koch over 2 years ago

TI__Expert 7035 points

Hi Kurumi,

The user is allowed to determine how they would like to cut the leads and bend them down to make contact with the board (this is also called trim and form). Some users have specific trim and form requirements, so we provide devices with straight leads to give them more flexibility with their designs. For the EVM, we use a subcontractor (usually Fancort) to provide the trim and form specifications for the device.

There are more details in this FAQ: PCB Footprint and Trim/Form Profiles of ceramic space power devices

Let me know if this answers your questions.

Thanks,

Sarah

0 Kurumi Hasegawa over 2 years ago in reply to Sarah Koch

TI__Expert 6341 points

Hi Sarah,

I understand. Thank you so much for your help.

Best regards,

Kurumi

Power management

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TPS7H2201-SP: Questions on CERAMIC DUAL FLATPACK Package