Other Parts Discussed in Thread: TPS7H2201EVM-CVAL
I’ve got quick questions on CERAMIC DUAL FLATPACK packages, and I’d like to confirm I understand it correct.
1. In the below figure, the lead looks floating ~0.9mm above. It is because of the thickness of the thermal pad I guess. How should I implement it? Is the lead supposed to be bend down slightly to contact with the board?
2. On the picture of the EVM (TPS7H2201EVM-CVAL), the leads are shorten. Is there any need for cutting the lead? Or, is it totally up to the system?