Hi Team,
Can you provide any information on the reflow/wave soldering conditions for the LT1009 i.e Maximum Reflow Temperature, Maximum time and maximum number of cycles being used in soldering?
Thanks,
Matt
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Hi Team,
Can you provide any information on the reflow/wave soldering conditions for the LT1009 i.e Maximum Reflow Temperature, Maximum time and maximum number of cycles being used in soldering?
Thanks,
Matt
Hi Matt,
Let me know if this document works for you.
https://www.ti.com/lit/an/spraby1a/spraby1a.pdf
Ben
Hi Matt,
According to what I have found on the internet, through hole devices like the T0-92 do not require MRL testing because through hole parts are not normally subjected to surface mount assembly conditions and are not prone to board level mounting induced popcorn problems. See below:
I found this information from:
https://www.analog.com/media/en/quality-documentation/2017_ReliabilityDataPack.pdf
Ben