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TLV62569: Thermal Resistor with different package type

Part Number: TLV62569

In the d/s, the package size the same from DDC and DBV. However, why the thermal resistor is total different? The DDC thermal resistance is much less than DBV package. What's the package tech behind? Could you share it? Very thanks. 

  • Hello Brian,

    In the DBV package, the die is attached to the lead frame through the bonding wire. Instead, the silicon is connected to the lead frame via solder BUMP in the DDC package, which has a much lower thermal resistance. It (DDC package) results in lesser junction-to-case and junction-to-top thermal resistance because heat can easily spread from the die to the lead frame then to the PCB.

    If you need additional details, please send me an email because there is confidential information that we cannot discuss on this platform.

    Thank you.

    Best regards,

    Excel

  • Hello Brian,

    Just a soft reminder.

    Are your queries address in my response above?

    Best regards,

    Excel