I have a question regarding the use of a TPS7H2201-SP. According to the datasheet, the thermal pad underneath the IC is internally connected to ground. Is it a requirement that this ground pad interface with ground on the board, or can we omit that electrical connection? I ask because we are planning on using a thermal interface material between the thermal pad and board which is electrically insulating. I want to make sure that removing that conduction path to ground does not adversely affect the IC operation.