Hi, Customer raised up an interesting question regarding the power-distribution switches TPS2557DRBR die mask and wondered what does additional "FFAB" marking on the silicon mask mean?
Also, are there any differences/variations on the form, fit, function or application between the two?
Here are details of the slight differences on the die markings:
DC 2108, from wafer site RFB/USA, die mask contains additional marking - "FFAB"
DC 2028, from Japan/MH8, no "FFAB" on the die mask
Appreciate if you can help provide the explanation and thanks for your time in advance.